Search results

  1. 1
  2. 2
  3. 3
  4. ...
  5. 2134
  6. 2135
  7. 2136

Connectors, Interconnects

Sockets for ICs, Transistors

Datasheet Image M-Part Number Manufacturer Description Quantity Est. Market Price Min. Quantity Packaging Series Part Status Type Numberof Positionsor Pins Grid Pitch Mating Contact Finish Mating Contact Finish Thickness Mating Contact Material Mating Mounting Type Features Termination Pitch Post Contact Finish Post Contact Finish Thickness Post Contact Material Post Housing Material Operating Temperature
Product Image 216-3340-00-0602J 3M

CONN IC DIP SOCKET ZIF 16POS GLD

1 Minimum: 1 Tube Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
Product Image 48-6554-11 Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

1 Minimum: 1 Bulk 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
Product Image A 08-LC-TT Assmann WSW Components

CONN IC DIP SOCKET 8POS TIN

1 Minimum: 1 Tube - Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
Product Image A 14-LC-TT Assmann WSW Components

CONN IC DIP SOCKET 14POS TIN

1 Minimum: 1 Tube - Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
Product Image ED281DT On Shore Technology Inc.

CONN IC DIP SOCKET 28POS TIN

1 Minimum: 1 Tube ED Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
Product Image 110-44-308-41-001000 Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 8POS TIN

1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Product Image AR 08 HZL-TT Assmann WSW Components

CONN IC DIP SOCKET 8POS TIN

1 Minimum: 1 Tube - Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
Product Image 4808-3004-CP 3M

CONN IC DIP SOCKET 8POS TIN

1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
Product Image 4816-3000-CP 3M

CONN IC DIP SOCKET 16POS TIN

1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
Product Image SA163000 On Shore Technology Inc.

CONN IC DIP SOCKET 16POS GOLD

1 Minimum: 1 Tube SA Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C